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Home > News > Aluminum nitride films by rf reactive ion‐plating
Aluminum nitride films by rf reactive ion‐plating
Aluminum nitride films were synthesized successfully on silicon (111) and spinel (111) single crystal surfaces by rf reactive ionplating. Aluminum was evaporated from an evaporator in the rf discharge phase of either nitrogen gas or ammonia gas at a pressure of 10-4 Torr (10-2 Pa). Film structures were evaluated using reflection high energy electron diffraction (RHEED) and scanning electron microscopy (SEM). The aluminum nitride films synthesized on the spinel (111) surfaces at the substrate temperature of 1000°C, in the rf discharge phase of both nitrogen gas and ammonia gas, were found to be of single crystal form, having parallel orientation to the substrate surfaces. Aluminum nitride single crystals forming hexagonal pyramids were observed to grow in the perpendicular direction to the substrate surfaces during the study. The growth rate of aluminum nitride film obtained in the ammonia gas discharge, which was about 500 Åmin-1, was about two times as fast as that obtained in the nitrogen gas discharge.
Source: IEEE
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