Company Name: Xiamen Powerway Advanced Material Co., Ltd
Tel: +86-592-5601404
Fax: +86-592-5745822
E-Mail: gan@powerwaywafer.com

Address: #3007-3008, No.89, Anling,Huli Developing Zone, Xiamen,China
Home > GaN Based LED Wafer > Blue LED Wafer > Blue Light on Flat Sapphire

Blue Light on Flat Sapphire

Model NO.:intanetcms000064
Blue Light on Flat Sapphire
FEATURE
 

p-GaN

P-layer

Activ regio (MQW)

n-GaN

GaN

GaN buffer

 

Sapphire substrate

 

 

 

Our wafers wil have folowing parameters:

GaN on flat sapphire epi wafer Specification(LED Epiwafer)

Blue445475 nm

1. Growth Technique - MOCVD

2. Diameter: 2”,3”,4”

3. Substrate material: Flat Sapphire Substrate(Al2O3)

 

4.Structure

Structure layers

Thickness(μm)

p-GaN

0.2

p-AlGaN

0.03

InGaN/GaN(active area)

0.2

n-GaN

2.5

u- GaN

2

Al2O3 (Substrate)

430

 

5.Packaging:

Wafers are stored in standard 25-wafer pack boxes with labels. Each wafer slot in the box corresponds to one wafer with corresponding serials number, product model and substrate number. The unique product model and substrate number define the identity of each wafer.

 

6.Product Storage
LED epitaxial wafers are highly sensitive to moisture and oxygen, which can be found in ambient condition. Storage in dry box or N2 cabinet is required. Further optimized conditions include ≤35ºC of temperature and/or ≤65% of humidity.

 

7.Surface Protection

We propose the following suggestions to prevent damages to wafer surface, as specific to our epitaxial wafer only:
a) Do NOT allow any liquid in contact with epitaxial wafer during storage or delivery.
b) Do NOT allow any sharp object in contact with epitaxial wafer at any time.
c) Use high quality, high-temperature- and wear-resistant tweezers (either plastic or vacuum type) to handle the epitaxial wafer during manufacturing.
d) Keep the epitaxial wafers placing in facing-upward condition, or only 1mm periphery of upper face in contact with objects.

 

8.Electrostatic Protection

LED chip products are highly sensitive to Electrostatic Discharge (ESD), though epitaxial wafers are generally free of ESD issues.
Therefore the protection to ESD is required through the whole process of LED chip manufacturing:
a) provide conductive floor and electrical grounding connection inside the factory
b) operating platform should be anti-electrostatic; and ensure all equipments having good electrical grounding.
c) workers should equip with antistatic clothing, wrist strap, or glove.
d) use ionizing air curtain and weld iron to provide electrical grounding.
e) packaging materials should be antistatic.