Blue Light on Flat Sapphire
Model NO.:intanetcms000064
|
p-GaN |
|
P-layer |
|
Active region (MQW) |
|
n-GaN |
|
GaN |
|
GaN buffer |
|
Sapphire substrate |
Our wafers wil have folowing parameters:
GaN on flat sapphire epi wafer Specification(LED Epiwafer)
Blue：445～475 nm
1. Growth Technique - MOCVD
2. Diameter: 2”,3”,4”
3. Substrate material: Flat Sapphire Substrate(Al2O3)
4.Structure
|
Structure layers |
Thickness(μm) |
|
p-GaN |
0.2 |
|
p-AlGaN |
0.03 |
|
InGaN/GaN(active area) |
0.2 |
|
n-GaN |
2.5 |
|
u- GaN |
2 |
|
Al2O3 (Substrate) |
430 |
5.Packaging:
Wafers are stored in standard 25-wafer pack boxes with labels. Each wafer slot in the box corresponds to one wafer with corresponding serials number, product model and substrate number. The unique product model and substrate number define the identity of each wafer.
6.Product Storage
LED epitaxial wafers are highly sensitive to moisture and oxygen, which can be found in ambient condition. Storage in dry box or N2 cabinet is required. Further optimized conditions include ≤35ºC of temperature and/or ≤65% of humidity.
7.Surface Protection
We propose the following suggestions to prevent damages to wafer surface, as specific to our epitaxial wafer only:
a) Do NOT allow any liquid in contact with epitaxial wafer during storage or delivery.
b) Do NOT allow any sharp object in contact with epitaxial wafer at any time.
c) Use high quality, high-temperature- and wear-resistant tweezers (either plastic or vacuum type) to handle the epitaxial wafer during manufacturing.
d) Keep the epitaxial wafers placing in facing-upward condition, or only 1mm periphery of upper face in contact with objects.
8.Electrostatic Protection
Therefore the protection to ESD is required through the whole process of LED chip manufacturing:
a) provide conductive floor and electrical grounding connection inside the factory
b) operating platform should be anti-electrostatic; and ensure all equipments having good electrical grounding.
c) workers should equip with antistatic clothing, wrist strap, or glove.
d) use ionizing air curtain and weld iron to provide electrical grounding.
e) packaging materials should be antistatic.