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Home > News > Microstructure and properties of copper thick-films over aluminium nitride substrates: optimization of a nitrogen based atmosphere
Microstructure and properties of copper thick-films over aluminium nitride substrates: optimization of a nitrogen based atmosphere
In order to improve the characteristics of copper thick film over aluminium nitride substrates, the authors studied the effects of oxygen additions to the nitrogen atmosphere of the furnace, at the level of the burnout zone. Experiments were carried out on both as-received and preoxidized AlN substrates. Scanning-electron-microscope examination of the copper film's microstructure and electron probe microanalysis were carried out on copper thick-film/AlN cross sections and correlated with properties such as adhesion and resistivity, allowing the establishment of ideal firing atmosphere conditions for the manufacture of copper thick films over AlN.
 
Source:IEEE
 
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